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后摩尔时代来临,语音IC封装技术一触即发

发布日期:[2019-09-23 17:40]    共阅[]次

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先进封装强势崛起,影响IC产业格局

MOERDINGLVDEYANSHENSHOUDAODUOZHONGYALI,RUWULIJIXIANHEJUEZIBENTOUZI。POQIEXUYAOZHAODAOLINGYIZHONGFANGFALAIJIXUJISHUJINBU。RANER,TONGGUOXIANJINDEFENGZHUANGHEJICHENGJISHU,KEYIGENGRONGYIDISHIXIANGAOMIDUJICHENG、XIAOXINGHUAHEDICHENGBEN。FENGZHUANGXINGYEJIANGZAIYUYINICDEJICHENGZHONGFAHUIGENGZHONGYAODEZUOYONG,YEJIANGDUICHANYEJIEGOUCHANSHENGGENGDADEYINGXIANG。SUIZHEXIANJINFENGZHUANGJISHUDEJINBU,YUYINICXINGYEJIANGCHENGXIANCHUYIXIEXINDEFAZHANQUSHI,ERJUYOUXIANJINFENGZHUANGJISHUDEYUYINICXINGYEYANGBENJIANGHUIYOUSUOBUTONG。

语音IC封装技术

170彩票注册 DANGQIANSHEHUIZHENGCHUYUXINJISHUYUXINYINGYONGQUANMIANBAOFADEBEIJINGXIA,YIDONGSHEBEI、DASHUJU、RENGONGZHINENG、5GTONGXIN、GAOXINGNENGJISUAN、WULIANWANG、ZHINENGQICHE、ZHINENGGONGYEDENGKUAISUFAZHAN。ZHEIXIEJISHUYUYINGYONGBIJIANGDUIDICENGXINPIANJISHUCHANSHENGXINDEXUQIU。JUMAIMUSIZIXUNDEJIESHAO,ZHICHIZHEIXIEXINXINGDAQUSHIDEDIANZIYINGJIANXUYAOGAOJISUANNENGLI、GAOSUDU、GENGDUODAIKUAN、DIYANCHI、DIGONGHAO、GENGDUOGONGNENG、GENGDUONEICUN、XITONGJIJICHENG、GENGJINGMIDECHUANGANQI,YIJIZUIZHONGYAODEDICHENGBEN。ZHEIXIEXINXINGQUSHIJIANGWEIGEZHONGFENGZHUANGPINGTAICHUANGZAOSHANGJI,ERXIANJINFENGZHUANGJISHUSHIMANZUGEZHONGXINGNENGYAOQIUHEFUZAYIGOUJICHENGXUQIUDELIXIANGXUANZE。

170彩票注册 MUQIANLAIKAN,SHANCHUXINGFENGZHUANG(FOWLP/)、XITONGJIFENGZHUANG(SiP)、3DFENGZHUANGSHIZUISHOUGUANZHUDESANZHONGXIANJINFENGZHUANGJISHU。SHANCHUXINGFENGZHUANGSHIJINGYUANJIFENGZHUANGZHONGDEYIZHONG,XIANGDUIYUCHUANTONGFENGZHUANGJUYOUBUXUYAOYINXIANKUANG、JIBANDENGJIEZHIDETEDIAN,YINCIKEYISHIXIANGENGQINGBODUANXIAODEFENGZHUANG。GENJUIC InsightYUJI,ZAIWEILAISHUNIANZHINEI,LIYONGSHANCHUXINGFENGZHUANGJISHUSHENGCHANDEXINPIAN,MEINIANJIANGYI32%DEZENGZHANGLVCHIXUKUODA,2023NIANSHANCHUXINGFENGZHUANGSHICHANGGUIMOJIANGCHAOGUO55YIMEIYUAN。

系统级封装可以将一个或多个IC芯片170彩票注册及被动元件整合在一个模块中,从而实现具有完整功能的电路集成,它也可以降低成本,缩短上市时间,同时克服了SoC中诸如工艺兼容、信号混合、噪声干扰、电磁干扰等难题。

3DFENGZHUANGTONGGUOJINGYUANJIHULIANJISHUSHIXIANXINPIANJIANDEGAOMIDUFENGZHUANG,KEYIYOUXIAOMANZUGAOGONGNENGXINPIANCHAOQING、CHAOBO、GAOXINGNENG、DIGONGHAOJIDICHENGBENDEXUQIU,BEIDADUOBANDAOTICHANGSHANGRENWEISHIZUIJUYOUQIANLIDEFENGZHUANGFANGFA。

总之,在市场需求的带动下,越来越多先进封装技术被开发出来,先进封装的市场占比将会进一步扩大。统计数据显示,从2017年到2023年,整个半导体封装市场的营收将以5.2%的年复合增长率增长,而先进封装市场将以7%的年复合增长率增长,市场规模到2023年将增长至390亿美元,传统封装市场的复合年增长率则低于3.3%。
 

先进封装技术,展现语音IC发展三大趋势

随着先进封装技术的发展以及市场规模的扩大,其对于整个语音IC产业结构将产生越来越大的影响。首先是中段工艺的出现并逐渐形成规模。随着传统封装技术向先进封装过渡,有别于传统封装技术的凸块(Bumping)、再布线(RDL)、硅通孔(TSV)等中段工艺被开发出来,并且开始发挥重要作用。中芯长电半导体首席执行官崔东表示,仅靠缩小线宽的办法已经无法同时满足性能、功耗、面积,以及信号传输速度等多方面的要求,因此半导体企业开始把注意力放在系统集成层面来寻找解决方案,也就是通过先进的硅片级封装技术,把不同工艺技术代的裸芯封装在一个硅片级的系统里,兼顾性能、功耗和传输速度的要求。这就产生了在硅片级进行芯片之间互联的需要,进而产生了凸块、再布线、硅通孔等中段工艺。而中段硅片加工的出现,也打破了前后段芯片加工的传统分工方式。

170彩票注册 QICI,ZHIZAOYUFENGZHUANGJIANGXINGCHENGXINDEJINGHEGUANXI。YOUYUXIANJINFENGZHUANGDAILAIDEZHONGDUANGONGYI,FENGCEYEHEJINGYUANZHIZAOYEYOULEGENGJINMIDELIANXI,ZAIDAILAIFAZHANJIYUDETONGSHI,YEMIANLINZHEXINDETIAOZHAN。ZHONGDUANFENGZHUANGDEJUEQIBIRANJIYAJINGYUANZHIZAOHUOZHEFENGZHUANGCESHIYEDEFENE。YOUJIXIANGBIAOMING,BUFENJINGYUANCHANGYIJIADAZAIZHONGDUANFENGZHUANGGONGYISHANGDEBUJU。JINGYUANCHANGYOUZHEJISHUHEZIBENDELINGXIANYOUSHI,JIANGDUIFENGCECHANGXINGCHENGJIAODADEJINGZHENGYALI。CHUANTONGFENGCECHANGJIAOJINGYUANZHIZAOYEXIANGBISHUYUQINGZICHAN,YINRUZHONGDUANGONGYIHOU,SHEBEIZICHANBIZHONGJIAOCHUANTONGFENGZHUANGDADAZENGJIA,FENGCEYEDEXIANJINJISHUYANFAHEKUOCHANJIANGMIANLINJIAODADEZIJINYALI。

最后,我们将提升语音IC的整体实力。后摩尔时代,语音IC产业更加重视产业链的紧密合作,加强了产业链上下游的内部联系。它要求不再单独制造和加工每个环节,而是要求系统设计、产品设计、前端工艺技术和封测各个环节开展更加紧密的合作。语音IC企业对先进封装业务的竞争最终应该表现为产业链之间综合实力的竞争。



 

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